The Center for Advanced Microelectronics Manufacturing (CAMM), a national flexible electronics prototype manufacturing facility, in conjunction with Binghamton University, Endicott Interconnect Technologies, Cornell University, the Flex Tech Alliance, Sandia National Laboratory, and the Binghamton Chapter of the IEEE CPMT is hosting the third annual Flexible Electronics Symposium on August 17-18, 2010 on the Binghamton University campus, in Binghamton, New York.
The symposium will bring together leading researchers from academia, national labs, and industry in the fields of flexible electronics, device and conductor printing, and emerging electronic materials to review and share new research findings in critical technology areas and identify issues for the rapidly growing flexible electronics field. It will provide an opportunity for discussion on key research and development areas and for sharing of ideas and information. One of the key objectives of the symposium will be to establish research and development needs in this field. As part of the symposium, attendees will be able to take a tour of the CAMM’s roll-to-roll manufacturing research center, located at partner, Endicott Interconnect Technologies, in Endicott, New York.
More information and registration is available at: http://www.wtsn.binghamton.edu/coned/fe10main.htm
